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Soldering, Desoldering and Rework Solutions Since 1958

Training Process Guides for Soldering, Repair & Rework for Electronics; Applications Support Services for Repair, Assembly and Rework of Electronics; On-site Training Classes for Soldering, Rework and Repair of Electronics.

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Nozzles for TF 1800, TF 1700 and TF 2700

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Process guides covering basic knowledge such as tip selection, tip preparation, land preparation, etc.

Addresses critical maintenance and troubleshooting steps to keep you and your equipment working at top performance and efficiency.

Nozzles for TF 1800, TF 1700 and TF 2700 BGA/Area Array Rework Systems

Image	Product	Part Number

BGA 21mm x 12.75mm (0.83" x 0.50") (7060)

4038-7060

BGA 20mm x 20mm (0.79" x 0.79") (7061)

4038-7061

BGA 15.6mm x 5.1mm (0.614" x 0.201") (4062)

4038-7062

BGA 15.24mm x 12.7mm (0.60" x 0.50") (7063)

4038-7063

BGA 44mm x 33mm (1.73" x 1.29") (7064)

4038-7064

QFP Nozzle 38.1mm x 25.8mm (1.50" x 1.01") (7066)

4038-7066

BGA 75mm x 75mm (2.95" x 2.95") (7069)

4038-7069

Nozzle, 14mm x 10mm (0.55" x 0.39") (7070)

4038-7070

Nozzle, 37mm x 37mm (1.45" x 1.45") (7071)

4038-7071

Nozzle, 16mm x 22mm (0.63" x 0.86") (7074)

4038-7074

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Nozzles for TF 1800, TF 1700 and TF 2700

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