Terms and Definitions

R-QFP-11

QFP Removal TT-65 Wrap

TT-65 ThermoTweez
TT-65 ThermoTweez
QFPs
QFPs

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues.

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

3. Install and align QFP removal tips into ThermoTweez® (using Tip Alignment Tool for QFP 84 pin count and above)

4. Tack solder to one of the corner component leads. Wrap solder around the four sides of component. Terminate solder at end of last side. (A)

5. Remove old solder from QFP tips with Fiber Tool from Tip Maintenance Station.

6. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station.

7. Tin bottom edges of tips with solder. (B)

8. Lower tips over component and tweeze handpiece, contacting ALL leads with tips. (C) & (D)

9. Confirm solder melt of ALL joints and lift component from PCB. (D) & (E)

10. Release component onto a heat resistant surface.

11. Re-tin tips with solder and return ThermoTweez® to its Tip & Tool Stand.

12. Prepare lands for component replacement.

PACE SensaTemp® or Intelliheat® Power Supply 

TT-65 ThermoTweez® 

QFP Removal Tips (See Chart on Back) 

Tip Alignment Tool 

PS-90 Universal Soldering Iron or TD-100 Thermo-Drive® Soldering Iron 

Tip Tool 

Tip Maintenance Station 

Flux-cored Solder 

Cleaner 

Product Image Dimensions Part Number
(A X B): 6.86mm x 6.86mm (0.27" X 0.27") 1121-0316-P1
(A X B): 9.4mm x 9.4mm (0.37" x 0.37") 1121-0317-P1
(A X B): 12.2mm x 9.65mm (O.48" x 0.38") 1121-0352-P1
(A X B): 14.5mm x 14.5mm (0.57" x 0.57") 1121-0318-P1
(A X B): 17.0mm x 17.0mm (0.67" x 0.67") 1121-0319-P1
(A X B): 21.9mm x 21.9mm (0.86" x 0.86") 1121-0320-P1
(A X B): 26.9mm x 26.9mm (1.06" x 1.06") 1121-0321-P1