Terms and Definitions

R-QFP-10

QFP Removal TT-65 Bridge Fill

TT-65 ThermoTweez
TT-65 ThermoTweez
QFPs
QFPs

1. Remove conformal coating (if any) and clean work of any contamination, oxides or residues.

2. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

3. Install and align QFP removal tips into ThermoTweez® (using Tip Alignment Tool for QFP 84 pin count and above).

4. Melt solder to form a solder bridge fill joining all component leads. (A)

5. Remove old solder from tips with Fiber Tool from Tip Maintenance Station.

6. Thermal shock tips with damp Sponge Tool from Tip Maintenance Station.

7. Tin bottom edges of tips with solder. (B)

8. Lower tips over component and tweeze handpiece, contacting ALL leads with tips. (C) & (D)

9. Confirm solder melt of ALL joints and lift component from PCB. (D) & (E)

10. Release component onto a heat resistant surface.

11. Re-tin tips with solder and return ThermoTweez® to its Tip & Tool Stand.

12. Prepare lands for component replacement.

PACE SensaTemp® or Intelliheat® Power Supply

TT-65 ThermoTweez®

QFP Removal Tips (See Chart on Back)

Tip Alignment Tool

PS-90 Universal Soldering Iron or TD-100 Thermo-Drive®

Soldering Iron

Mini-Wave® Tip

Tip Tool

Tip Maintenance Station

Flux-cored Solder

Cleaner

Product Image Dimensions Part Number
(A X B): 12.2mm x 9.65mm (O.48" x 0.38") 1121-0352-P1
(A X B): 6.86mm x 6.86mm (0.27" X 0.27") 1121-0316-P1
(A X B): 14.5mm x 14.5mm (0.57" x 0.57") 1121-0318-P1
(A X B): 17.0mm x 17.0mm (0.67" x 0.67") 1121-0319-P1
(A X B): 21.9mm x 21.9mm (0.86" x 0.86") 1121-0320-P1
(A X B): 26.9mm x 26.9mm (1.06" x 1.06") 1121-0321-P1