Terms and Definitions

G-TIP-01

Tip Preparation & Maintenance

Tip Cleaning/Tinning:

Proper cleaning and tinning of a tip will remove oxidation and increase heat transfer to the solder joint(s). This layer of solder on the working end of the tip also protects the plated surface beneath and extends tip life.

The following procedure provides general guidelines for tip cleaning and tinning.

1. Install the tip in the handpiece. Allow time for the tip to reach the selected temperature, 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys.  Adjust as necessary.

2. Remove all solder dross and flux residues from the tip by wiping the tip on a moistened sponge. Wiping of the tip on a dry or debris-filled sponge may contaminate the tip and ultimately the pcb. The PACE Tip Maintenance Station (P/N 6993-0138) is essential for the proper preparation and maintenance of surface mount removal tips. The Sponge Tool and Fiber Tool from the Tip Maintenance Station should be used to effectively remove any heavy accumulations of flux or solder residue. (refer to A)

3. Using a large gauge, flux core wire solder, tin the tip end in the following manner.

a) Single Point Tips (refer to B) - Place a small amount of solder on each surface of the tip end. Wipe off excess solder (except Mini-Wave tip).
b) Surface Mount Removal & Flat Blade Tips (refer to C) - Place a bead of solder along the length of the bottom edge of each tip blade.
c) Chip & SOT Tips (refer to C) - Place a bead of solder along the inside edges of the tip end.

4. Place the handpiece in its Tip & Tool Stand.