Terms and Definitions

G-BGA-00

Land Preparation for BGA w/ SX-100

SX-100 Sodr-X-Tractor
SX-100 Sodr-X-Tractor

1. Set a tip temperature of 343°C (650°F) for lead-free or 316°C (600°F) for leaded alloys and adjust as necessary.

2. Install Flo-D-Sodr tip into the SX-100 Solder Extractor using the tip tool.

3. Apply flux as needed to the land areas on the PCB and component. (A)

4. Clean and thermally shock the tip with a damp sponge.

5. Tin the bottom of the tip. (B)

6. Lower the tip, perpendicular to the PCB, contacting the lands at a corner portion of the array with a very light pressure. (C)

7. Allow solder to melt at the point of contact, apply vacuum and slowly sweep the tip over the remaining lands on the array. (D)

8. Lift the tip from the array upon completion. (E)

9. Repeat steps 7 - 9 for the land pattern on the component

10. Re-Tin the tip with solder and return the SX-100 Solder Extractor to its tip and tool stand.

11. Clean lands on array pattern as required for component placement.

PACE SensaTemp Power Supply with Vacuum
Capability
SX-100 Handpiece
SX-100 Tip and Tool Stand
Flo-D-Sodr Tip
Tip Tool
Flux
Cleaner
Solder
Product Image Dimensions Part Number
1121-0945-P5